Welcome to advanced packaging. Throughout this course,
we will introduce you to pathways for assembly and packaging technologies for seven nanometer silicon
feature sizes and beyond. We will present the
evolution and impact of packaging on product
performance and innovation. Specifically, we highlight how packaging has enabled
better products via the use of heterogeneous
integration for improving the interconnects for thermal management
and signal integrity. Thank you for joining us. We hope you will
enjoy the materials.